About this component
This is a full-size solderless breadboard with 830 tie-points, making it perfect for complex and large circuit prototyping. It features two continuous dual power rail lines on both sides, allowing for extensive voltage and ground connections. The central logic area consists of two columns of 63 rows (A-E and F-J), separated by a central channel, ideal for mounting dual in-line package (DIP) ICs. Made from high-quality, durable ABS plastic with internal nickel-plated bronze spring clips, it ensures reliable, temporary connections without soldering. The back includes a pre-applied double-sided adhesive tape for easy mounting to project bases.
📋 Specifications
| Total Tie-Points | 830 (2 columns x 63 rows central, 4 power rails x 25 rows each) |
| Central Matrix | 2 columns, rows 1-63, columns A-E and F-J. |
| Power Rails | 4 extensive dual power rails (marked red and blue). |
| Material | ABS plastic with nickel-plated phosphor bronze internal metal clips |
| Compatible Wire Size | 21 to 26 AWG (0.4mm to 0.7mm diameter solid core wire) |
| Dimensions | ~165mm x 55mm |
| Mounting | Pre-applied double-sided self-adhesive tape on the back |
| Expandability | Interlocking edge tabs to connect multiple boards together |
| Operating Voltage / Current | Recommended for low-voltage DC (3.3V, 5V, 12V) up to 3A |
🔌 Wires & Connectors
Full-Size Solderless Breadboard - 830 Points (MB102)
Brand: Generic
SKU: BB-FULL-830
₹40
₹80
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Per piece
✅ In Stock (20 available)
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📦 Genuine components, quality tested
🔄 7-day return policy
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